Thermal fatigue in module power supply.New, higher power density products will be the future of the non-isolated point-of-load DC/DC module power supply market. Reliability is a major issue that all system designers need to address. Many distributed power architecture applications require years of normal operation and are essentially non-faulty. Reliability plays an important role in the total cost of ownership of the system.
Reliability has become an important issue that must be addressed by module power supplies due to the large number of component combinations and packages, thermal fatigue caused by high power density, and associated circuit failure. Thermal fatigue in the module power supply is caused by low power conversion efficiency and limited heat dissipation space. This situation eventually increases the temperature and shortens the life of the product. To reduce the effect of temperature on Mean Time Between Failure (MTBF), system designers should consider cooling, airflow, and module power loss degradation curves.
When comparing module efficiencies, you should not only care about the electrical performance at 25 °C, but also consider the system ambient temperature, airflow, and module cooling methods. In many applications, the module power supply needs to work in harsh environments.